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Description
The Mechanics of Solder Alloy Interconnects by John H. Lau, Steven N. Burchett,Item specifics Condition: Like New : Seller Notes: Minor identifying marks on inside cover page shown in photos. Language: English ISBN: 9780442015053 About this product Product Information The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand alone resource for a particular aspect of materials and modeling issues. With this gained

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