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Infinity Bond IM-A6110 Battery Assembly APAO Hot Melt - 20 Second Open TimeAbout Infinity Bond IM A6110 Battery Assembly Hot Melt Infinity Bond IM A6110 is a high performance, short to medium open time APAO hot melt used in product assembly. This adhesive is especially popular in battery assembly and bonding applications. A6110 offers great hot and cold resistance, a low viscosity and strong bond to a wide range of substrates. Bonds To Foam Plastics (PP, PE, Vinyl and more) Wood Metals Fabric Felt

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4.6 ★★★★★
Based on 2486 reviews
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Product Reviews
★★★★★ 5
Deep dive into Linux Kernel Architecture
Format: Paperback
Have you been wanting to figure out the innards of the Linux kernel without getting overwhelmed or have been working without enough context to actually understanding it, here is a fantastic book.
If you are fascinated with operating systems and new to it, if you have wondered what terms like system calls, timers, threads mean and how they are developed? This book is for you.
Major subsystems and features of the Linux kernel like System calls, Memory Management, Loadable Kernel Module framework, Kernel config, Virtual Address Space, Page Cache and Kernel build(for x86 and ARM) are detailed very well in the book. The delivery through both practical and theoretical focus, can meet the expectations of both professional and academic needs.
When used along with Linux kernel documentation, this book is bound to provide a deeper, well structured understanding of Linux kernel architecture.
Yet to complete reading the entire book and I'm sure that it will keep me interested.
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Reviewed in the United States on March 23, 2021
★★★★★ 1
Bad book
Format: Paperback
A book that says comprehensive guide to Linux kernel should include more information about linux kernel internals with proper examples and explanation how kernel actually work and not just very high level overview of the modules building process. Don't waste your time and money. Linux device drivers book is much much better books than this one and provide way more details than this one.
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Reviewed in the United States on May 13, 2023
★★★★★ 5
Lots of good info, easy to read
Format: Paperback
Okay, I do need to disclose that I was one of the technical reviewers for this book, and that I'm also a fellow Packt Publishing author. Reviewing the book was a fun project, which I really enjoyed. There's a lot of good information here, and lots of hands-on projects for both x86_64 and Raspberry Pi. The author writes in a clear, concise, and conversational style that makes the material really easy to digest.
If you have a good foundation of C programming knowledge and want to get into Linux kernel programming, you'll definitely want to check this book out.
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Reviewed in the United States on March 31, 2021
★★★★★ 5
ASM and CPP best of both worlds in Windows env
Format: Paperback
A must read if you are interested in writing assmbly code that communicates with C++ code in a windows envionment.
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Reviewed in the United States on March 12, 2023
★★★★★ 5
A good book but...(update, formatting fixed)
Format: Kindle
A good book but the code in the Kindle edition is very badly formatted. The downloaded source code seems correct.
Update formatting issue seems to have been fixed.
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Reviewed in the United States on February 7, 2022
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